Senior Principal Product/Test Lead

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About the position

This is a great opportunity to join Arm's Silicon Solutions System/Product/Test (SPT) Team, working with emerging process technologies and the latest packaging innovations. SPT works closely with SoC Design, Architecture, Systems, Software, and Quality teams, while building foundational productization capability. You will play a key role in preparing Arm and our partners for how to address production challenges in areas like 2.5D/3D and sub-3nm nodes. The successful candidate will lead activities such as: manufacturing test enablement, product definition, SOC bring-up/characterization, and test data analysis/reporting. The ideal candidate will have experience leading SOC product development teams, with depth and passion for building new capabilities.

Responsibilities

  • Lead a team of SPT engineers accountable for productization of high performance SOC, including all NPI ATE/SLT activities
  • Develop/deliver manufacturing test solutions for high performance SOCs
  • Work with operations team on ATE/SLT bring-up, characterization and productization
  • Drive first silicon bring-up on ATE and SLT, reporting daily progress across the organization
  • Up to 20% travel within US and internationally for company and partner meetings

Requirements

  • Proven experience leading NPI of high-performance SoC's
  • Broad understanding of DFT (Scan, MBIST, PHY BIST, etc), ATE, SLT, silicon fabrication process, packaging, etc
  • Silicon data analysis including performance/yield sensitivities within foundry, assembly, and test processes
  • Demonstrated ability in product/test engineering, including manufacturing test, yield improvement, silicon characterization and reliability qualification

Nice-to-haves

  • Proficient in data analysis techniques and tools, such as excel, Tableau, JMP, etc
  • Experience with Streaming Scan Network (SSN), IJTAG, scan diagnostics, FI/FA techniques, Q&R concepts, etc
  • Expert knowledge of SOC concepts such as: DVFS/SVC, sensor calibration, FMAX/VMIN determination, OTP/eFuse allocation/management, logic harvesting, etc
  • Productization of 2.5D and 3D System-in-Package (SiP), including multi-SKU product definition

Benefits

  • Competitive salary range of \$297,600-\$402,600 per year
  • Total reward package shared during recruitment process
  • Accommodations available during recruitment process
  • Hybrid working environment that supports high performance and personal wellbeing
  • Equal opportunity employer with a commitment to diversity and inclusion
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